Sequans Communications (NYSE:SQNS) Stock Passes Above 200 Day Moving Average – What’s Next?

Sequans Communications S.A. (NYSE:SQNS) shares crossed above its 200-day moving average during trading on Tuesday . The stock has a 200-day moving average of $0.72 and traded as high as $2.41. Sequans Communications shares last traded at $2.28, with a volume of 64,293 shares changing hands.

Analysts Set New Price Targets

Several equities research analysts have recently commented on the stock. Roth Mkm reiterated a “buy” rating and set a $3.00 price target on shares of Sequans Communications in a research report on Monday, August 26th. StockNews.com initiated coverage on Sequans Communications in a research note on Tuesday, October 8th. They issued a “sell” rating for the company.

Sequans Communications Stock Performance

The company has a market capitalization of $141.22 million, a P/E ratio of -2.89 and a beta of 0.25. The stock’s fifty day moving average price is $1.06 and its 200-day moving average price is $0.72.

Sequans Communications (NYSE:SQNS) last issued its quarterly earnings data on Friday, August 23rd. The semiconductor company reported ($0.12) earnings per share (EPS) for the quarter, hitting analysts’ consensus estimates of ($0.12). The firm had revenue of $9.68 million for the quarter, compared to the consensus estimate of $9.70 million. On average, research analysts predict that Sequans Communications S.A. will post -1.47 EPS for the current fiscal year.

About Sequans Communications

Sequans Communications SA engages in the fabless designing, developing, and supplying of cellular semiconductor solutions for massive and broadband Internet of Things (IoT) markets in Taiwan, Korea, China, rest of Asia, Germany, the United States, and internationally. It offers baseband solutions for use in encoding and decoding data based on 4G and 5G protocols for wireless processing platform for a cellular device; RF transceivers used to transmit and receive wireless transmissions; highly integrated SoC solutions that combine various functions into a single die or package; and LTE modules.