Oxford Instruments (LON:OXIG) Price Target Cut to GBX 2,830 by Analysts at Berenberg Bank

Oxford Instruments (LON:OXIGFree Report) had its target price decreased by Berenberg Bank from GBX 2,925 ($36.86) to GBX 2,830 ($35.66) in a report released on Tuesday morning, MarketBeat.com reports. Berenberg Bank currently has a buy rating on the stock.

Separately, Shore Capital reiterated a “buy” rating on shares of Oxford Instruments in a research report on Wednesday, October 16th.

Check Out Our Latest Research Report on Oxford Instruments

Oxford Instruments Trading Down 0.2 %

Shares of OXIG stock opened at GBX 2,105 ($26.53) on Tuesday. The company has a debt-to-equity ratio of 12.96, a quick ratio of 1.11 and a current ratio of 1.64. The stock has a fifty day simple moving average of GBX 2,091.43 and a two-hundred day simple moving average of GBX 2,304.02. The firm has a market capitalization of £1.22 billion, a PE ratio of 2,447.67, a PEG ratio of -3.56 and a beta of 0.96. Oxford Instruments has a 52-week low of GBX 1,932 ($24.35) and a 52-week high of GBX 2,765 ($34.85).

Oxford Instruments Cuts Dividend

The company also recently disclosed a dividend, which will be paid on Friday, January 10th. Shareholders of record on Thursday, November 28th will be paid a GBX 5.10 ($0.06) dividend. This represents a yield of 0.24%. The ex-dividend date is Thursday, November 28th. Oxford Instruments’s payout ratio is 2,441.86%.

About Oxford Instruments

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Oxford Instruments plc provide scientific technology products and services for academic and commercial organizations worldwide. It operates through three segments: Materials & Characterisation, Research & Discovery, and Service & Healthcare. The company offers atomic force, electron, and Raman microscopy; deposition tools comprising plasma enhanced chemical vapour deposition, chemical vapour deposition, inductively coupled plasma chemical vapour deposition, atomic layer deposition, and ion beam deposition systems; and etch tools, including inductively coupled plasma etching, reactive ion etching, deep silicon etching, atomic layer etching, and ion beam etching systems.

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