Sequans Communications (NYSE:SQNS) Shares Cross Above 200 Day Moving Average – Time to Sell?

Sequans Communications S.A. (NYSE:SQNS) shares crossed above its 200-day moving average during trading on Thursday . The stock has a 200-day moving average of $2.18 and traded as high as $3.30. Sequans Communications shares last traded at $3.30, with a volume of 136,552 shares traded.

Wall Street Analyst Weigh In

Separately, StockNews.com raised Sequans Communications from a “sell” rating to a “hold” rating in a research note on Tuesday, November 12th.

Sequans Communications Trading Up 4.1 %

The stock has a market cap of $82.48 million, a P/E ratio of 2.34 and a beta of 0.36. The company has a debt-to-equity ratio of 0.01, a quick ratio of 1.33 and a current ratio of 1.36. The firm’s fifty day simple moving average is $2.80 and its 200-day simple moving average is $2.18.

Institutional Inflows and Outflows

A hedge fund recently bought a new stake in Sequans Communications stock. Oddo BHF Asset Management Sas bought a new position in shares of Sequans Communications S.A. (NYSE:SQNS) in the 3rd quarter, according to the company in its most recent disclosure with the Securities & Exchange Commission. The firm bought 2,900,000 shares of the semiconductor company’s stock, valued at approximately $3,451,000. Oddo BHF Asset Management Sas owned 11.60% of Sequans Communications at the end of the most recent reporting period. Hedge funds and other institutional investors own 63.33% of the company’s stock.

Sequans Communications Company Profile

Sequans Communications SA engages in the fabless designing, developing, and supplying of cellular semiconductor solutions for massive and broadband Internet of Things (IoT) markets in Taiwan, Korea, China, rest of Asia, Germany, the United States, and internationally. It offers baseband solutions for use in encoding and decoding data based on 4G and 5G protocols for wireless processing platform for a cellular device; RF transceivers used to transmit and receive wireless transmissions; highly integrated SoC solutions that combine various functions into a single die or package; and LTE modules.